Embedded in resin, the KMP gage measures cure-shrinkage and internal strain.
The compact design enables embedment in shaped resins and is suitable for internal stress measurement of products made by combining epoxy resin and metal.
|Materials Resistive element||CuNi alloy foil|
|Operating temperature in combination with major adhesives after curing (°C)||Embedment: 20 to 150ºC|
|Operating temperature in combination with major leadwire cables (°C)||Polyester-coated wires: 20 to 150ºC|
|Self-temperature-compensation (°C)||20 to 120ºC|
|Applicable linear expansion coefficients (×10-6/℃)||-|
|Strain limits at normal temp. (approx. %)||-|
|Fatigue lives at normal temp. (times)||-|