Adhesives and Bonding Tools

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Operating temperature range

  • High temperature
  • Normal to Mid/High Temperature
  • Ultra low

Curing

  • Cured at normal temperature
  • Cured by heating

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CC-33A
Instantaneous adhesive cured at normal temperatures

CC-33A

Specifications

Type Instantaneous adhesive cured at normal temperatures
Features • Suitable for bonding general-purpose gages, such as KFG, KFGS and KFR, which are used for general stress measurement at normal temperatures of 20 to 80℃.
• Quick curing time and stable bonding of various materials in a wide range of temperature and humidity ranges.
• Quick curing ensures smooth bonding works.
• Enables measurement in approximately 1hour from bonding.
Curing Requirements Apply finger pressure (100 to 300 kPa) for 15 to 60 seconds. Then, leave the gage as it is for 1 hour. The finger pressure application time differs depending on temperature and humidity conditions. The lower the temperature and humidity, the longer the finger pressure application time required.
Operating Temperature -196 to 120
Ingredients 1 type of cyanoacrylate liquid
Content 2 g × 1 or 2 g × 5
Main material ・Metals (Steel, stainless steel, copper, aluminum alloys A1050/A2024, etc.)
・Plastics (acrylate, vinyl chloride, nylon, etc.)
・Composite materials (CFRP, GFRP, printed board, etc.)
・Rubber

CC-35
Instantaneous adhesive cured at normal temperatures

CC-35

Specifications

Type Instantaneous adhesive cured at normal temperatures
Features ・Suitable for bonding a gage to porous materials such as concrete for general stress measurement at normal temperatures of 20 to 80℃.
・High viscosity makes it suitable for bonding to porous materials such lumber and concrete.
Curing Requirements Apply finger pressure (100 to 300 kPa) for 15 to 60 seconds. Then, leave the gage as it is for 1 hour. The finger pressure application time differs depending on temperature and humidity conditions. The lower the temperature and humidity, the longer the finger pressure application time required.
Operating Temperature -30 to 120
Ingredients 1 type of cyanoacrylate liquid
Content 2 g × 1 or 2 g × 5
Main material ・Concrete
・Mortar
・Lumber

CC-36
Instantaneous adhesive cured at normal temperatures

CC-36

Specifications

Type Instantaneous adhesive cured at normal temperatures
Features ・Suitable for bonding a high-elonation gage such as KFEM and KFEL at normal temperatures of 20 to 80℃.
・Suitable for bonding to hard-to-bond materials such as aluminum alloy (A7075) and magnesium alloy.
・High peeling resistance, high impact resistance and less aging deteriotation of bonding strength
・Strong bonding power to hard-to-bond materials.
・Curing time is longer than CC-33A.
Curing Requirements Apply finger pressure (100 to 300 kPa) for 15 to 60 seconds. Then, leave the gage as it is for 1 hour. The finger pressure application time differs depending on temperature and humidity conditions. The lower the temperature and humidity, the longer the finger pressure application time required.
Operating Temperature -30 to 100
Ingredients 1 type of cyanoacrylate liquid
Content 2 g × 1 or 2 g × 5
Main material ・Metals (Steel, stainless steel, copper, aluminum alloys A1050/A2024/A7075, magnesium alloy, etc.)
・Plastics (acrylate, vinyl chloride, nylon, polypropylene, etc.)
・Composite materials (CFRP, GFRP, printed board, etc.)
・Concrete
・Mortar
・Lumber
・Rubber

EP-34B
Cured at normal temperatures or by heating

EP-34B

Specifications

Type Cured at normal temperatures or by heating
Features ・Suitable for strain measurement at middle temperatures and for bonding gages for transducers.
Curing Requirements ・Apply pressure (30 to 50 kPa) for 24 hours at approx. 25℃ or for 2 hours at 80℃.
・Pressing is possible with tape.
Operating Temperature -55 to 200
Ingredients 2 types of epoxy liquid mixed
Content 30 g (Main agent: 5.6 g × 4, Curing agent: 2.1 g × 4)
Main material ・Metals (Steel, stainless steel, copper, aluminum alloy, etc.)
・Plastics (acrylate, PVC, etc.)
・Composite materials (CFRP, GFRP, printed board, etc.)

PC-600
Cured by heating

Specifications

Type Cured by heating
Features Suitable for strain measurement at low, middle and high temperatures and for
bonding dages for transducers.
Curing Requirements Apply pressure (150 to 300KPa) for 1 hour at 80℃, 2 hours at 130℃ and then, 2 hours at 150℃.
Operating Temperature -269 to 250
Ingredients 1 heating type of phenol liquid
Content 100 g
Main material Metal (Steel, Stainless steel, copper, aluminum alloys, etc.)

PI-32
Cured by heating

PI-32

Specifications

Law
Type Cured by heating
Features • Suitable for bonding gages for strain measurement at high temperature.
Curing Requirements Apply pressure (200 to 500 kPa) for 1 hour at 100℃, 2 hours at 200℃ and then, heat for 2 hours at the operating temperature with the pressure removed.
If it is difficult to heat to 200℃, "2 hours at 200℃" may be changed to "5 hours at 160℃" with all other conditions followed.
Operating Temperature -269 to 350
Ingredients 1 heating type of Polyimide liquid
Content 20 g
Main material ・Metal (Steel, Stainless steel, copper, aluminum alloys, etc.)

PC-12B
Cured at room temperature

PC-12B

Specifications

Law Air transport prohibited
Type Cured at room temperature
Features ・Suitable for bonding semiconductor gages or gages for concrete strain measurement (KC, KFG and KFGS).
Curing Requirements Apply pressure (30 to 50kPa) for 2 hours. Release the pressure and cure it for 24 hours
Operating Temperature -196 to 250
Ingredients 2 type of polyester liquid mixed
Content 32 g (Main agent: 30 g, Curing agent: 2 g)
Main material ・Metal (Steel, Stainless steel, copper, aluminum alloys, etc.)
・Concrete
・Mortar

EP-17
Cured by heating

EP-17

Specifications

Type Cured by heating
Features ・Dedicated for semiconductor gages (KSN-2-120-E5) .
(Shrinked after curing)
Curing Requirements After finger pressure, apply tape pressure while heating it for cure for 2 hours at 130℃, 2 hours at 150℃
Operating Temperature -50 to 170
Ingredients Epoxy liquid and power mixed
Content 30 g
Main material ・Metal (Steel, Stainless steel, copper, aluminum alloys, etc.)

EP-270
Cured at room temperature

Specifications

Type Cured at room temperature
Features ・Suitable for bonding gages for strain measurement at very low temperatures.
Curing Requirements Apply pressure (50±20 kPa) for 24 hours at approx. 25°C
Operating Temperature -269 to 30
Ingredients 2 types of liquid mixed
Content 50 g (Main agent: 25 g, Curing agent: 25 g)
Main material ・Metals (Iron, stainless steel, aluminum alloy, etc.)

EP-340
Cured at normal temperatures or by heating

Specifications

Type Cured at normal temperatures or by heating
Features ・Suitable for bonding gages for strain measurement at middle temperatures.
Curing Requirements Apply pressure (100±50kPa) for 24 hours at approx. 25°C or for 2 hours at 80°C. Pressing is possible with tape.
Operating Temperature -55 to 150
Ingredients 2 types of liquid mixed
Content 30 g (Main agent: 6 g × 4, Curing agent: 1.5 g × 4)
Main material ・Metals (Iron, stainless steel, aluminum alloy, etc.)

EP-370
For bonding gages embeddable in bolts

EP-370

Specifications

Type 2 types of epoxy liquid mixed,Cured at normal temperatures and by heating
Features For bonding gages embeddable in bolts.
Curing Requirements 24 hours or more at a room temperature,5 hours or more at 80 °C
Operating Temperature room temp. to 50
Ingredients Epoxy
Content 40 g (Main agent: 30 g, Curing agent: 10 g)

S-7
Curing agent

S-7

Specifications

Type Curing promotion agent
Features A curing promotion agent to be used with instantaneous adhesive CC-33A (Applicable environment, low in temperature and dry such as in winter)
Content 25 g

S-9B
surface treatment agent

S-9B

Specifications

Type Surface preparing agent
Features Aims to promote adhesive strength of the adhesive used to bond a strain gage onto plastics such as polyester, nylon 66, polyproperen, and polyethylene, which hardly accept adhesives. (As a surface preparing agent)
Content 40 g

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